公开(公告)号：US11177203B2

公开(公告)日：2021-11-16

申请号：US16279336

申请日：2019-02-19

申请人： FAIRCHILD SEMICONDUCTOR CORPORATION

发明人： Jerome Teysseyre ,  Romel Manatad ,  Chung-Lin Wu ,  Bigildis Dosdos ,  Erwin Ian Almagro ,  Maria Cristina Estacio

IPC分类号： H01L23/498 ,  H01L23/495

摘要： In a general aspect, an apparatus can include a leadframe including a plurality of leads disposed along a single edge of the apparatus. The apparatus can also include an assembly including a substrate and a plurality of semiconductor die disposed on the substrate, the assembly being mounted on the leadframe and an inductor having a first terminal and a second terminal. The first terminal of the inductor can be electrically coupled with the leadframe via a first conductive clip, where the first terminal of the inductor can be coupled with a contact pad of the first conductive clip. The second terminal of the inductor can be electrically coupled with the leadframe via a second conductive clip, where the second terminal of the inductor can be coupled with a contact pad of the second conductive clip. The leadframe, the assembly and the inductor can be arranged in a stacked configuration.

公开(公告)号：US10256178B2

公开(公告)日：2019-04-09

申请号：US15692354

申请日：2017-08-31

申请人： FAIRCHILD SEMICONDUCTOR CORPORATION

发明人： Jerome Teysseyre ,  Romel Manatad ,  Chung-Lin Wu ,  Bigildis Dosdos ,  Erwin Ian Almagro ,  Maria Cristina Estacio

IPC分类号： H01L23/498 ,  H01L23/495

摘要： In a general aspect, an apparatus can include a leadframe including a plurality of leads configured to be coupled with a printed circuit board. The plurality of leads can be disposed along a single edge of the apparatus. The apparatus can also include an assembly including a substrate and a plurality of semiconductor die disposed on the substrate. The assembly can being mounted on the leadframe. The apparatus can further include an inductor having a first terminal and a second terminal. The first terminal of the inductor can being coupled with the leadframe via a first contact pad, and the second terminal of the inductor can be coupled with the leadframe via a second contact pad. The leadframe, the assembly and the inductor can be arranged in a stacked configuration.