公开(公告)号：US20240170881A1

公开(公告)日：2024-05-23

申请号：US18522067

申请日：2023-11-28

申请人： FCI USA LLC

发明人： Aymeric Soudy ,  Cyril Jeune ,  Amaud Hyppias

IPC分类号： H01R13/436 ,  H01R4/18 ,  H01R13/428 ,  H01R13/627

CPC分类号： H01R13/4367 ,  H01R4/185 ,  H01R13/428 ,  H01R13/4362 ,  H01R13/6272 ,  H01R13/6275

摘要： In various embodiments, compact connector designs may be provided that have reduced board pitch (e.g., 1.80 mm, 1.50 mm, 1.27 mm, etc.), but are still capable of accommodating large electrical conductors (e.g., 1.4 mm, 1.1 mm, 0.9 mm, etc.). In this manner, PCB footprint may be reduced (e.g., by 50% when a staggered connector configuration is used), while adequate current carrying capacity may be maintained (e.g., 2 A, 3 A, 4 A, etc.). Additionally, or alternatively, one or more other advantages may be achieved, such as ruggedness (e.g., vibration endurance), error proofing, configuration flexibility, ease of manufacturing, ease of assembly, and/or lowered costs.