公开(公告)号：US20170334088A1

公开(公告)日：2017-11-23

申请号：US15527216

申请日：2015-10-09

Applicant: FLOORING TECHNOLOGIES LTD.

Inventor： Ingo LEHNHOFF ,  Frank OLDORFF

IPC: B27N7/00 ,  B44C5/04 ,  B32B21/06 ,  B32B21/02

CPC classification number: B27N7/005 ,  B32B21/02 ,  B32B21/06 ,  B32B2260/028 ,  B32B2260/046 ,  B32B2307/50 ,  B32B2307/554 ,  B32B2451/00 ,  B44C5/04

Abstract: The invention relates to a method for finishing a wood board with an upper face and a lower face. A layer of liquid synthetic resin is first applied at least onto the upper face or the lower face, and at least one paper ply soaked with a synthetic resin is then applied. The structure is then pressed in a press under high pressure and at a high temperature, wherein the synthetic resin melts and is connected to the upper face or the lower face of the wood board. The invention is characterized in that the upper face and/or the lower face is provided while still having a press skin and in an ungrounded state, and the layer is applied so thinly that the liquid synthetic resin is completely drawn into the press skin, the layer is not actively dried, and the paper ply is positioned on the press skin.

公开(公告)号：US20210230880A1

公开(公告)日：2021-07-29

申请号：US16972430

申请日：2019-04-02

Applicant: Flooring Technologies Ltd.

Inventor： Frank OLDORFF ,  Ingo LEHNHOFF ,  Norbert KALWA ,  Rüdiger KLUPSCH ,  Thomas LEHMANN

IPC: E04F15/02 ,  E04F15/10 ,  B44C5/04 ,  B44C1/24

Abstract: The disclosure relates to a method for finishing a supplied building panel made of a wood material, in particular MDF or HDF, with an upper side and a lower side, wherein, in a first embossing step, a relief is embossed at least into the upper side as first strip-shaped depressions with two opposing side walls, a bottom wall connecting said side walls and a depth (T), and subsequently a decorative pattern (3) is printed on the embossed upper side of the building panel, and the decorative pattern is then sealed by applying an abrasion-resistant layer (4). According to the invention, additional depressions extending at an angle (α) transversely to the first depressions are embossed, and the large-format supplied building panel is divided into individual panels by carrying out a saw cut in and along each of the depressions.

公开(公告)号：US20210323343A1

公开(公告)日：2021-10-21

申请号：US16972837

申请日：2019-06-07

Applicant: Flooring Technologies Ltd.

Inventor： Roger BRAUN ,  Frank OLDORFF ,  Ingo LEHNHOFF ,  Norbert KALWA ,  Rüdiger KLUPSCH

IPC: B44C5/04 ,  B44C1/24 ,  B32B21/06 ,  B32B21/02 ,  E04F13/08 ,  E04F13/10

Abstract: The disclosure relates to a method for finishing a panel, the method includes a) a relief embossed into the upper side in the form of at least one strip-shaped depression with a depth (T), b) a decorative paper applied to the upper side, c) an overlay paper applied to the decorative paper as an abrasion-resistant layer, d) the lower side provided with a backing layer, e) the structure pressed at a high pressure and temperature, and f) during the pressing, at least one strip-shaped depression is again embossed in a second embossing without changing the depth (T). Also, the upper side features a press skin that has a thickness of 0.3 to 0.5 mm, the bulk density of the panel in a top layer is between 950 and 1,000 kg/m3, and an aqueous melamine resin is applied to the upper side as a tempering agent before or after embossing.

公开(公告)号：US20180243940A1

公开(公告)日：2018-08-30

申请号：US15966620

申请日：2018-04-30

Applicant: FLOORING TECHNOLOGIES LTD.

Inventor： Ingo LEHNHOFF ,  Frank OLDORFF

IPC: B27N7/00 ,  B32B21/06 ,  B44C5/04

CPC classification number: B27N7/005 ,  B32B21/02 ,  B32B21/06 ,  B32B2260/028 ,  B32B2260/046 ,  B32B2307/50 ,  B32B2307/554 ,  B32B2451/00 ,  B44C5/04

Abstract: The disclosure relates to a method for finishing a wood board with an upper face and a lower face. A layer of liquid synthetic resin is first applied at least onto the upper face or the lower face, and at least one paper ply soaked with a synthetic resin is then applied. The structure is then pressed in a press under high pressure and at a high temperature, wherein the synthetic resin melts and is connected to the upper face or the lower face of the wood board. The invention is characterized in that the upper face and/or the lower face is provided while still having a press skin and in an ungrounded state, and the layer is applied so thinly that the liquid synthetic resin is completely drawn into the press skin, the layer is not actively dried, and the paper ply is positioned on the press skin.