公开(公告)号：US20250059347A1

公开(公告)日：2025-02-20

申请号：US18896933

申请日：2024-09-26

Applicant: FUJIFILM Corporation

Inventor： Kazuya OOTA ,  Atsuyasu NOZAKI ,  Michihiro OGAWA ,  Kenji DAIKUHARA

IPC: C08K5/00 ,  C08F2/50 ,  C08F283/04 ,  C08G73/12 ,  H01L21/48 ,  H01L23/498

Abstract: There is provided a resin composition containing a polyimide or a polyimide precursor, where a cured substance obtained from the resin composition satisfies all of the following conditions (i) to (iv), and are provided a cured substance, a laminate, a manufacturing method for a cured substance, a manufacturing method for a laminate, a manufacturing method for a semiconductor device, and a semiconductor device; condition (i): a Young's modulus of the cured substance is 3.5 GPa or more, condition (ii): a coefficient of thermal expansion of the cured substance in a temperature range of 25° C. to 125° C. is less than 50 ppm/° C., condition (iii): a Tg of the cured substance is 240° C. or higher, and condition (iv): a breaking elongation of the cured substance is 40% or more.