公开(公告)号：US20210385965A1

公开(公告)日：2021-12-09

申请号：US17407166

申请日：2021-08-19

Applicant: FUJIFILM Corporation

Inventor： Tetsuro MITSUI ,  Naotoshi SATO ,  Miyoko HARA ,  Masahiro HATTA ,  Hiroshi KAWAKAMI ,  Hirokazu KITO ,  Aya NAKAYAMA ,  Takuto MATSUSHITA ,  Kyohei OGAWA

IPC: H05K7/20 ,  F28D20/02 ,  F28D21/00

Abstract: An object of the present invention is to provide a heat storage member having excellent flame retardance. Another object of the present invention is to provide an electronic device including a heat storage member, a manufacturing method of a heat storage member, and a composition for forming a protective layer.
The heat storage member according to an embodiment of the present invention includes a protective layer and a heat storage layer including a heat storage material, in which the protective layer has a crosslinking structure.

公开(公告)号：US20210293489A1

公开(公告)日：2021-09-23

申请号：US17313008

申请日：2021-05-06

Applicant: FUJIFILM Corporation

Inventor： Tetsuro MITSUI ,  Naotoshi SATO ,  Miyoko HARA ,  Masahiro HATTA ,  Hirokazu KITO ,  Hiroshi KAWAKAMI ,  Aya NAKAYAMA ,  Takuto MATSUSHITA ,  Kyohei OGAWA

IPC: F28D20/02

Abstract: An object of the present invention is to provide a heat storage sheet in which the occurrence of defects when handling it is suppressed, and a heat storage member and an electronic device including the heat storage sheet.
The heat storage sheet according to an embodiment of the present invention includes a microcapsule which encapsulates a heat storage material, in which a void volume is less than 10% by volume.