公开(公告)号：US20140168510A1

公开(公告)日：2014-06-19

申请号：US14184204

申请日：2014-02-19

Applicant: FUJIFILM Corporation

Inventor： Shu HAMADA ,  Hitoshi SHIMAMURA ,  Yoshiyuki TAKASE

IPC: H04N5/225 ,  H05K3/30

CPC classification number: H04N5/2253 ,  H01L27/14618 ,  H01L2924/0002 ,  H04N5/2257 ,  H05K3/30 ,  Y10T29/4913 ,  H01L2924/00

Abstract: The front face of an opening in a first wiring substrate is covered by a transparent substrate, a light-receiving face is made to face the opening, and an imaging element chip is flip-chip bonded to the rear face side of the first substrate. A gap formed between connection terminals between the periphery of the light-receiving face of the imaging element chip and the peripheral edge section of the opening is buried in a first resin, and the entire rear face of the imaging element chip and the rear face side of the first substrate are covered by a second resin. At the front face on this rear face side, an exposed conductive portion substantially parallel with the front face of the transparent substrate is covered with the second resin. A second wiring substrate is electrically and mechanically connected to the first substrate.

Abstract translation: 第一布线基板的开口的正面由透明基板覆盖，使受光面朝向开口部，并将成像元件芯片倒装贴合在第一基板的背面侧。 在成像元件芯片的光接收面的周围与开口的周缘部之间的连接端子之间形成的间隙埋设在第一树脂中，并且成像元件芯片的后面和背面侧 的第一衬底被第二树脂覆盖。 在该背面侧的前表面，与第二树脂覆盖与透明基板的前面大致平行的露出导电部。 第二布线基板电连接和机械地连接到第一基板。