OPTICAL INTEGRATED DEVICE, OPTICAL INTEGRATED CIRCUIT WAFER, AND METHOD OF MANUFACTURING THE OPTICAL INTEGRATED DEVICE

    公开(公告)号:US20230084190A1

    公开(公告)日:2023-03-16

    申请号:US17884895

    申请日:2022-08-10

    IPC分类号: G02B6/122 G02B6/136 G02B6/30

    摘要: An optical integrated device includes a substrate and a waveguide that has a hollow structure. The waveguide includes a first waveguide and a second waveguide that is optically coupled to the first waveguide and that has a smaller relative refractive index difference than that of the first waveguide and converts a mode diameter to a mode diameter of an optical fiber in accordance with travelling of light. The optical integrated device includes a dent portion that is formed in the vicinity of the dicing line on the substrate such that the width of the output end surface is smaller than the core width of the optical fiber that is optically coupled to the output end surface in the state in which the dicing end surface of the substrate protrudes farther than the output end surface of the second waveguide in the axial direction of the optical waveguide.

    OPTICAL MODULE AND MANUFACTURING METHOD THEREOF

    公开(公告)号:US20200206842A1

    公开(公告)日:2020-07-02

    申请号:US16594828

    申请日:2019-10-07

    IPC分类号: B23K26/20 H01L31/18 H04B10/40

    摘要: An optical module includes an optical semiconductor chip having a first surface that includes a laser beam irradiation region and a cleavage region, an optical fiber optically coupled to the first surface, and a support member having a second surface bonded to the first surface, and configured to support the optical fiber. The optical semiconductor chip has an optical signal input and output part located in the cleavage region, and the second surface is bonded to the first surface within the cleavage region.