-
公开(公告)号:US20200210667A1
公开(公告)日:2020-07-02
申请号:US16623443
申请日:2018-08-21
Applicant: Fingerprint Cards AB
Inventor: Hanna NILSSON , Adam BENSON , Karl LUNDAHL
Abstract: A method for manufacturing a fingerprint sensor device. The method comprises providing a fingerprint sensor chip, arranging the fingerprint sensor chip on a carrier, depositing a cover layer on the fingerprint sensor chip, the cover layer comprising a polarizable material; moving a top electrode into contact with a top surface of the cover layer; and applying a voltage between the top electrode and a bottom electrode located below the cover layer and comprised in a material stack between the bottom of the carrier and the cover layer, creating an electric field in the cover layer, thereby poling the cover layer such that a dielectric constant of the cover layer in a direction perpendicular to the sensing array is higher than a dielectric constant in a direction parallel to the sensing array, thereby forming a cover layer having an anisotropic dielectric constant.
-
公开(公告)号:US20210209324A1
公开(公告)日:2021-07-08
申请号:US17058943
申请日:2019-05-27
Applicant: Fingerprint Cards AB
Inventor: Karl LUNDAHL , Hanna NILSSON , Adam BENSON , Martin GRIP
IPC: G06K9/00 , A61B5/1172 , G01S15/89
Abstract: An acoustic biometric imaging system comprising: a transparent device member having a first face to be touched by a finger surface of a user, and a second face opposite the first face, the transparent device member having a first acoustic impedance; a first ultrasonic transducer acoustically coupled to the second face of the transparent device member in a first transducer region for receiving acoustic signals conducted by the transparent device member from a finger touch region laterally spaced apart from the first transducer region, the first ultrasonic transducer having a second acoustic impedance; and an opaque masking layer arranged between the transparent device member and the first ultrasonic transducer in the first transducer region, the opaque masking layer having a third acoustic impedance between the first acoustic impedance and the second acoustic impedance.
-