公开(公告)号：US11295189B2

公开(公告)日：2022-04-05

申请号：US15733899

申请日：2019-05-27

Applicant: FingerPrint Cards AB

Inventor： Karl Lundahl ,  Olivier Lignier

IPC: G06K5/00 ,  G06K19/07 ,  G06K19/077

Abstract: Method for manufacturing a smartcard comprising a fingerprint sensor, the method comprising: arranging a fingerprint sensor module in an opening of a carrier layer of a smartcard body; forming a cavity in the smartcard in an area corresponding to a sensing area of the fingerprint sensor module; forming a plurality of surface structures in the cavity of the smartcard; depositing a liquid hydrophobic material in the cavity to at least partially cover the surface structures and a smartcard manufactured according to the described method.

公开(公告)号：US11501553B2

公开(公告)日：2022-11-15

申请号：US16763671

申请日：2018-11-15

Applicant: Fingerprint Cards AB

Inventor： Olivier Lignier

IPC: G06V40/13 ,  H01L21/56 ,  H01L23/31 ,  H04M1/02

Abstract: A method of manufacturing a fingerprint sensor component having a component outline for integration into an electronic device, the method comprising the steps of: providing a fingerprint sensor package having a sensing surface, a connection surface opposite the sensing surface, and sides connecting the sensing surface and the connection surface, the connection surface having connectors for allowing electrical connection of the fingerprint sensor component to the electronic device; arranging the fingerprint sensor package on a temporary carrier with the connection surface facing the temporary carrier; and adding material at least around the sides of the fingerprint sensor package, while leaving the connection surface of the fingerprint sensor package uncovered.