公开(公告)号：US20180171653A1

公开(公告)日：2018-06-21

申请号：US15851133

申请日：2017-12-21

Applicant: Fluor Technologies Corporation

Inventor： Martin Birch ,  Adrian La Porta ,  Raymond Laing ,  Neil Lewis

IPC: E04H1/00 ,  E04H5/02 ,  E04B1/348 ,  E04B1/343

CPC classification number: E04H1/005 ,  E04B1/34315 ,  E04B1/3483 ,  E04H5/02 ,  E04H2001/1283

Abstract: Embodiments relate generally to reconfigurable modular processing facilities and methods for constructing and operating such. For example, a method for constructing a reconfigurable modular processing facility may comprise assembling a plurality of vertical walls, wherein the spaces between the walls define a plurality of stations; assembling a plurality of horizontal levels, wherein the spaces between the levels and the walls define the plurality of stations; constructing a lift within a center portion of the facility, wherein the lift is configured to access each of the plurality of stations; assembling one or more pods sized to fit within the stations, wherein the pods contain process equipment; configuring a process within the facility by moving one or more pods into one or more stations; and connecting the one or more pods to one another to complete the configuration of the process.