公开(公告)号：US06818526B2

公开(公告)日：2004-11-16

申请号：US10263511

申请日：2002-10-02

申请人： Freidoon Mehrad ,  Zhihao Chen ,  Juanita Deloach

发明人： Freidoon Mehrad ,  Zhihao Chen ,  Juanita Deloach

IPC分类号： H01L21336

CPC分类号： H01L21/76224

摘要： A method of fabricating a shallow trench isolation structure includes forming outwardly of a semiconductor layer a first oxide layer. A nitride layer is formed outwardly of the first oxide layer. A second oxide layer is formed outwardly of the nitride layer. A trench is formed through the first oxide layer, the nitride layer, and the second oxide layer and into the semiconductor layer. With the second oxide layer protecting an upper surface of the nitride layer, the nitride layer is etched to form a lateral recessed side boundary of the trench at the nitride layer. The shallow trench isolation layer is formed in the trench.

摘要翻译： 制造浅沟槽隔离结构的方法包括在半导体层向外形成第一氧化物层。 在第一氧化物层的外部形成氮化物层。 在氮化物层的外侧形成第二氧化物层。 通过第一氧化物层，氮化物层和第二氧化物层形成沟槽并进入半导体层。 利用第二氧化物层保护氮化物层的上表面，蚀刻氮化物层以在氮化物层处形成沟槽的侧凹侧边界。 在沟槽中形成浅沟槽隔离层。

公开(公告)号：US20090004853A1

公开(公告)日：2009-01-01

申请号：US11770593

申请日：2007-06-28

申请人： Haowen Bu ,  Shashank Ekbote ,  Juanita Deloach

发明人： Haowen Bu ,  Shashank Ekbote ,  Juanita Deloach

IPC分类号： H01L21/44

CPC分类号： H01L21/28518

摘要： The present application is directed to a method for forming a metal silicide layer. The method comprises providing a substrate comprising silicon and depositing a metal layer on the substrate. The metal layer is annealed within a first temperature range and for a first dwell time of about 10 milliseconds or less to react at least a portion of the metal with the silicon to form a silicide. An unreacted portion of the metal is removed from the substrate. The silicide is annealed within a second temperature range for a second dwell time of about 10 milliseconds or less.

摘要翻译： 本申请涉及形成金属硅化物层的方法。 该方法包括提供包括硅的衬底并在衬底上沉积金属层。 金属层在第一温度范围内退火，并且在约10毫秒或更短的第一停留时间内使至少一部分金属与硅反应形成硅化物。 将金属的未反应部分从基材上除去。 硅化物在第二温度范围内退火约10毫秒或更短的第二停留时间。

公开(公告)号：US07897513B2

公开(公告)日：2011-03-01

申请号：US11770593

申请日：2007-06-28

申请人： Haowen Bu ,  Shashank Ekbote ,  Juanita Deloach

发明人： Haowen Bu ,  Shashank Ekbote ,  Juanita Deloach

IPC分类号： H01L21/44

CPC分类号： H01L21/28518

摘要： The present application is directed to a method for forming a metal silicide layer. The method comprises providing a substrate comprising silicon and depositing a metal layer on the substrate. The metal layer is annealed within a first temperature range and for a first dwell time of about 10 milliseconds or less to react at least a portion of the metal with the silicon to form a silicide. An unreacted portion of the metal is removed from the substrate. The silicide is annealed within a second temperature range for a second dwell time of about 10 milliseconds or less.

摘要翻译： 本申请涉及形成金属硅化物层的方法。 该方法包括提供包括硅的衬底并在衬底上沉积金属层。 金属层在第一温度范围内退火，并且在约10毫秒或更短的第一停留时间内使至少一部分金属与硅反应形成硅化物。 将金属的未反应部分从基材上除去。 硅化物在第二温度范围内退火约10毫秒或更短的第二停留时间。