公开(公告)号：US20040261636A1

公开(公告)日：2004-12-30

申请号：US10899679

申请日：2004-07-26

申请人： Fry's Metals, Inc. d/b/a Alpha Metals, Inc.

发明人： Ian McPhee Fleck ,  Ron Tripp ,  Prashant Chouta ,  Scott Craig

IPC分类号： B41M001/12 ,  B41N001/24

CPC分类号： B41N1/24 ,  B41M1/12 ,  H05K3/1225

摘要： A stencil used for printing solder paste on a contact pad of a printed wiring board has interior surfaces that define one or more apertures through the stencil. Those interior surfaces are coated with a material, such as parylene, having a lower surface tension than the interior surfaces absent the coating. The stencil can also have one or more reverse-tapered apertures passing there through, wherein the apertures have a variable cross-section that is larger at the fill side of the stencil (i.e., where solder paste enters the apertures) than at the board side of the stencil (i.e., where the stencil contacts the contact pad of the printed wiring board). Solder paste can be printed through the aperture(s) of the stencil onto contact pads on a printed wiring board.

摘要翻译： 用于在印刷线路板的接触焊盘上印刷焊膏的模板具有限定通过模板的一个或多个孔的内表面。 这些内表面涂覆有诸如聚对二甲苯的材料，其表面张力低于没有涂层的内表面。 模板还可以具有一个或多个穿过其中的倒锥形孔，其中孔具有在模板的填充侧较大的可变横截面（即，焊膏进入孔），而不是在板侧 （即，模板接触印刷电路板的接触垫的位置）。 焊膏可以通过模板的孔被印刷到印刷线路板上的接触垫上。