公开(公告)号：US06476504B1

公开(公告)日：2002-11-05

申请号：US09993772

申请日：2001-11-27

申请人： Fu Tang Chu ,  Ji Ping Teng

发明人： Fu Tang Chu ,  Ji Ping Teng

IPC分类号： H01L2348

CPC分类号： H01L24/83 ,  H01L24/27 ,  H01L24/29 ,  H01L24/743 ,  H01L2224/2919 ,  H01L2224/743 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/00

摘要： An adhesive pattern for attaching a semiconductor chip onto a non-uniform substrate is disclosed. The adhesive pattern comprises a double-k pattern formed on the substrate. The double-k pattern includes a longest major line and four shorter lines connected to the major line. The non-uniform substrate has a conductive circuit and a solder mask formed on the substrate including the circuit. The substrate has a die covering region for receiving the semiconductor chip. The conductive circuit of the substrate comprises a plurality of conductive traces unequally distributed on the die covering region. The double-k adhesive pattern of the present invention is applied onto the non-uniform substrate by a dispenser in a manner that the area on the substrate defined between the major line and the border of the die covering region has a trace density lower than the other area on the substrate.

摘要翻译： 公开了一种用于将半导体芯片附着在不均匀衬底上的粘合剂图案。 粘合剂图案包括在基底上形成的双k图案。 双k图案包括最长的主线和连接到主线的四条较短的线。 不均匀衬底具有形成在包括电路的衬底上的导电电路和焊接掩模。 衬底具有用于接收半导体芯片的管芯覆盖区域。 衬底的导电电路包括不均匀分布在管芯覆盖区域上的多个导电迹线。 通过分配器将本发明的双k粘合剂图案施加到不均匀的基底上，使得限定在模具覆盖区域的主线和边界之间的基板上的区域的痕量密度低于 衬底上的其他区域。