公开(公告)号：US11415764B2

公开(公告)日：2022-08-16

申请号：US17132918

申请日：2020-12-23

Applicant: Fujitsu Optical Components Limited

Inventor： Teruhiro Kubo ,  Yuka Ojima ,  Tetsuo Ishizaka ,  Tomoyuki Ito

IPC: H04B10/00 ,  G02B6/42 ,  H05K1/02 ,  H05K7/20

Abstract: An optical module includes: a board that is accommodated in a housing and in which a through hole is formed; a metal plate that is bonded to an area of the board including the through hole; a component that is mounted on one surface of the metal plate and is arranged inside the through hole; and a thermal-conductive member that is arranged on another surface of the metal plate and transmits heat generated by the component to the housing.

公开(公告)号：US09335490B2

公开(公告)日：2016-05-10

申请号：US14329026

申请日：2014-07-11

Applicant: FUJITSU OPTICAL COMPONENTS LIMITED

Inventor： Shinji Maruyama ,  Yoshihiko Yoshida ,  Tomoyuki Ito ,  Yoshihiro Takahashi ,  Yoshinobu Kubota

IPC: G02B6/42 ,  H04B10/50 ,  G02B6/12

CPC classification number: G02B6/42 ,  G02B6/4214 ,  G02B2006/12166 ,  G02F2201/58 ,  H04B10/50 ,  H04B10/60 ,  Y10T29/49128

Abstract: An optical device includes a substrate having an electrooptical effect, and including an optical waveguide that guides light and a reflection groove having a bottom face that reflects light output from the optical waveguide; and a light-receiving element positioned above the reflection groove and fixed to the substrate. The light output from the optical waveguide into the reflection groove is reflected by the bottom face of the reflection groove while traveling through a space inside the reflection groove and is incident to the light-receiving element.

Abstract translation: 光学器件包括具有电光效应的衬底，并且包括引导光的光波导和具有反射从光波导输出的光的底面的反射槽; 以及位于反射槽上方并固定于基板的光接收元件。 从光波导输出到反射槽的光在反射槽内反射并反射到反射槽的底面并入射到光接收元件。

公开(公告)号：US20210278614A1

公开(公告)日：2021-09-09

申请号：US17132918

申请日：2020-12-23

Applicant: Fujitsu Optical Components Limited

Inventor： TERUHIRO KUBO ,  YUKA OJIMA ,  Tetsuo Ishizaka ,  Tomoyuki Ito

IPC: G02B6/42 ,  H05K7/20 ,  H05K1/02

Abstract: An optical module includes: a board that is accommodated in a housing and in which a through hole is formed; a metal plate that is bonded to an area of the board including the through hole; a component that is mounted on one surface of the metal plate and is arranged inside the through hole; and a thermal-conductive member that is arranged on another surface of the metal plate and transmits heat generated by the component to the housing.