公开(公告)号：US20210061998A1

公开(公告)日：2021-03-04

申请号：US17095679

申请日：2020-11-11

Applicant: Furukawa Electric Co., Ltd.

Inventor： Takumi ASANUMA ,  Hideyuki IKEDA ,  Shota SUGIYAMA

IPC: C08L81/06 ,  C08L71/02

Abstract: The present disclosure provides a base film for an adhesive tape used in a manufacturing process of a semiconductor that can be used in a plurality of processes including a reflow process.
A thermoplastic resin film, which is a resin composite of a first resin component that is a crystalline thermoplastic resin having a melting point of 290° C. or higher and a second resin component that has a glass transition temperature of 150° C. or higher, wherein the crystallinity of the first resin component is more than 5.0% of the entire resin composite.

公开(公告)号：US20200039023A1

公开(公告)日：2020-02-06

申请号：US16586545

申请日：2019-09-27

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Nobutoshi YOKOTA ,  Shota SUGIYAMA ,  Takashi NARIMATSU

IPC: B24B37/26 ,  B24B37/24

Abstract: An object of the present disclosure is to provide an abrasive pad that is superior in abrading performance and abrasive slurry discharging properties.An abrasive pad having an abrading part and a groove part on an abrasive surface is provided in which a surface of the groove part has a non-foamed part, and a foamed part is exposed on a surface of the abrading part.