Abstract:
A highly reliable organic electroluminescence device and a manufacturing method includes at least one organic electroluminescence element, a structure, a to-be-covered portion and a passivation film. On a substrate, the organic electroluminescence element includes an anode, an organic layer including an organic light emitting layer, and a cathode. The structure is disposed on the substrate, and thickness of the structure is greater than that of the organic electroluminescence element. The to-be-covered portion is disposed at a step bottom portion of the structure and is formed such that the curvature radius of the cross-sectional shape of the to-be-covered portion at the step bottom portion is at least 0.3 micrometers. The passivation film covers the organic electroluminescence element, the structure and the to-be-covered portion.
Abstract:
The present invention relates to a flexible organic EL device comprising, on one of the surfaces of an organic resin base, an inorganic protective layer, an organic EL light emitting part, a buffer layer, and a breakage-resistant layer in this order, wherein the buffer layer is a silicone or EPDM containing layer and an elastic modulus of the breakage-resistant layer at 5 to 35° C. is 100 MPa to 300 GPa.
Abstract:
A highly reliable organic electroluminescence device is provided.An organic electroluminescence device 1 includes at least one layer of inorganic barrier film 4, at least one organic electroluminescence element 5, and a sealed portion. The inorganic barrier film 4 is formed to contact to a flexible substrate 2 or at least one layer of organic resin film 3 formed on the substrate 2. The organic electroluminescence element 5 is formed on the inorganic barrier film 4 and includes an anode 51, an organic layer 52 including an organic light emitting layer, and a cathode 53. The sealed portion includes at least one of a flexible sealing film 8 and a sealing membrane 6, and blocks at least one organic electroluminescence element 5 from the air outside. The formed surface of the inorganic barrier film 4 is held to maintain a state in which a compressive stress is applied.