公开(公告)号：US20220274166A1

公开(公告)日：2022-09-01

申请号：US17749823

申请日：2022-05-20

Applicant: General Electric Company

Inventor： Michelle Lynn Sloderbeck ,  Christopher Hall ,  Laura Banks ,  Tim Murphy ,  David Ploetz ,  Zachary Fieldman ,  Christopher C. Chapman ,  Emily Bautista ,  MacKenzie Ryan Redding

IPC: B22F3/093 ,  B22F3/03 ,  B33Y40/00 ,  B33Y80/00 ,  B33Y10/00 ,  B33Y30/00 ,  B30B11/02 ,  B22F12/00

Abstract: The present disclosure generally relates to powder packing for additive manufacturing (AM) methods and systems. Conventional powder packing methods are manual and non-standardized, and they result in operator fatigue and potentially product inconsistencies. Powder packing according to the present disclosure improves standardization and reduces turnaround time, with the potential to lower the cost of AM.

公开(公告)号：US11667095B2

公开(公告)日：2023-06-06

申请号：US17749823

申请日：2022-05-20

Applicant: General Electric Company

Inventor： Michelle Lynn Sloderbeck ,  Christopher Hall ,  Laura Banks ,  Tim Murphy ,  David Ploetz ,  Zachary Fieldman ,  Christopher C. Chapman ,  Emily Bautista ,  MacKenzie Ryan Redding

IPC: B22F3/093 ,  B22F3/03 ,  B33Y40/00 ,  B33Y80/00 ,  B33Y10/00 ,  B33Y30/00 ,  B30B11/02 ,  B22F12/00 ,  B33Y40/10 ,  B22F12/30 ,  B22F12/37 ,  B22F12/90 ,  B22F10/28

CPC classification number: B30B11/022 ,  B22F3/03 ,  B22F3/093 ,  B22F12/30 ,  B22F12/37 ,  B22F12/90 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/00 ,  B33Y40/10 ,  B33Y80/00 ,  B22F10/28 ,  B22F2999/00 ,  B22F2999/00 ,  B22F12/30 ,  B22F12/37 ,  B22F12/90 ,  B22F2202/01 ,  B22F2203/13

Abstract: The present disclosure generally relates to powder packing for additive manufacturing (AM) methods and systems. Conventional powder packing methods are manual and non-standardized, and they result in operator fatigue and potentially product inconsistencies. Powder packing according to the present disclosure improves standardization and reduces turnaround time, with the potential to lower the cost of AM.

公开(公告)号：US11351605B2

公开(公告)日：2022-06-07

申请号：US15599169

申请日：2017-05-18

Applicant: GENERAL ELECTRIC COMPANY

Inventor： Michelle Lynn Sloderbeck ,  Christopher Hall ,  Laura Banks ,  Tim Murphy ,  David Ploetz ,  Zachary Fieldman ,  Christopher C. Chapman ,  Emily Bautista ,  MacKenzie Ryan Redding

IPC: B22F3/093 ,  B22F3/03 ,  B33Y40/00 ,  B33Y80/00 ,  B30B15/00 ,  B33Y10/00 ,  B33Y30/00 ,  B30B11/02 ,  B22F12/00 ,  B22F10/10

Abstract: The present disclosure generally relates to powder packing for additive manufacturing (AM) methods and systems. Conventional powder packing methods are manual and non-standardized, and they result in operator fatigue and potentially product inconsistencies. Powder packing according to the present disclosure improves standardization and reduces turnaround time, with the potential to lower the cost of AM.