公开(公告)号：US20180100905A1

公开(公告)日：2018-04-12

申请号：US15840451

申请日：2017-12-13

Applicant: General Electric Company

Inventor： Jean-Baptiste Mathieu ,  Saban Kurucay ,  Thomas Kwok-Fah Foo ,  Yanzhe Yang

IPC: G01R33/385 ,  H01F41/04

CPC classification number: G01R33/3858 ,  G01R33/3856 ,  H01F41/04

Abstract: The embodiments disclosed herein relate generally to magnetic resonance imaging systems and, more specifically, to the manufacturing of a gradient coil assembly for magnetic resonance imaging (MRI) systems. For example, in one embodiment, a method of manufacturing a gradient coil assembly for a magnetic resonance imaging system includes depositing a first layer comprising a base material onto a surface to form a substrate and depositing a second layer onto the first layer. The second layer may enable bonding between a conductor material and the substrate. The method also includes depositing a third layer onto the second layer using a consolidation process. The consolidation process uses the conductor material to form at least a portion of a gradient coil.

公开(公告)号：US09869734B2

公开(公告)日：2018-01-16

申请号：US13859586

申请日：2013-04-09

Applicant: General Electric Company

Inventor： Jean-Baptiste Mathieu ,  Saban Kurucay ,  Thomas Kwok-Fah Foo ,  Yanzhe Yang

IPC: G01R33/385 ,  H01F41/04

CPC classification number: G01R33/3858 ,  G01R33/3856 ,  H01F41/04

Abstract: The embodiments disclosed herein relate generally to magnetic resonance imaging systems and, more specifically, to the manufacturing of a gradient coil assembly for magnetic resonance imaging (MRI) systems. For example, in one embodiment, a method of manufacturing a gradient coil assembly for a magnetic resonance imaging system includes depositing a first layer comprising a base material onto a surface to form a substrate and depositing a second layer onto the first layer. The second layer may enable bonding between a conductor material and the substrate. The method also includes depositing a third layer onto the second layer using a consolidation process. The consolidation process uses the conductor material to form at least a portion of a gradient coil.

公开(公告)号：US20140302258A1

公开(公告)日：2014-10-09

申请号：US13859586

申请日：2013-04-09

Applicant: GENERAL ELECTRIC COMPANY

Inventor： Jean-Baptiste Mathieu ,  Saban Kurucay ,  Thomas Kwok-Fah Foo ,  Yanzhe Yang

IPC: G01R33/38

CPC classification number: G01R33/3858 ,  G01R33/3856 ,  H01F41/04

Abstract: The embodiments disclosed herein relate generally to magnetic resonance imaging systems and, more specifically, to the manufacturing of a gradient coil assembly for magnetic resonance imaging (MRI) systems. For example, in one embodiment, a method of manufacturing a gradient coil assembly for a magnetic resonance imaging system includes depositing a first layer comprising a base material onto a surface to form a substrate and depositing a second layer onto the first layer. The second layer may enable bonding between a conductor material and the substrate. The method also includes depositing a third layer onto the second layer using a consolidation process. The consolidation process uses the conductor material to form at least a portion of a gradient coil.

Abstract translation: 本文公开的实施例一般涉及磁共振成像系统，更具体地涉及用于磁共振成像（MRI）系统的梯度线圈组件的制造。 例如，在一个实施例中，制造用于磁共振成像系统的梯度线圈组件的方法包括将包括基材的第一层沉积到表面上以形成衬底并将第二层沉积到第一层上。 第二层可以实现导体材料和衬底之间的接合。 该方法还包括使用固结方法将第三层沉积到第二层上。 固结过程使用导体材料形成梯度线圈的至少一部分。