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公开(公告)号:US20150082655A1
公开(公告)日:2015-03-26
申请号:US14492912
申请日:2014-09-22
申请人: GEW (EC) Limited
发明人: Malcolm Rae , Benjamin Tyler , Robert Rae
CPC分类号: B41F23/0486 , B41F23/0409 , B41F23/0453 , B41J11/002 , F26B23/06
摘要: An LED array (1) for UV print curing comprising one or more LED modules (2), the array (1) comprising a body (5) which comprises a mounting area (4) comprising one or more LED modules (2) mounted thereon, and two or more fixing holes (6) through the body (5), the position of said fixing holes (6) corresponding to the position of fixing holes (7) in the one or more LED modules (2) mounted on the mounting area (4), wherein the one or more LED modules (2) are secured to the body (5) by pins (8, 38) which pass through the fixing holes (7) within the LED module (2) and through the fixing holes (6) in the body (5), said pins (8, 38) comprising a head (9, 39) and a stem (10, 40), wherein the head (10, 40) engages with a conductive surface (11) on the LED module (2) and the stem (10, 40) is connectable to a power supply for providing power to the conductive surface (11) of the LED module (2) via the head (10, 40).
摘要翻译: 一种用于UV印刷固化的LED阵列(1),包括一个或多个LED模块(2),所述阵列(1)包括主体(5),所述主体包括安装在其上的一个或多个LED模块(2)的安装区域(4) ,和通过本体(5)的两个或更多个固定孔(6),所述固定孔(6)的位置对应于安装在安装件上的一个或多个LED模块(2)中的固定孔(7)的位置 区域(4),其中所述一个或多个LED模块(2)通过穿过所述LED模块(2)内的固定孔(7)的销(8,38)固定到所述主体(5),并且通过所述固定 主体(5)中的孔(6),所述销(8,38)包括头部(9,39)和杆(10,40),其中头部(10,40)与导电表面 )和所述杆(10,40)可连接到电源,用于经由头部(10,40)向LED模块(2)的导电表面(11)提供电力。