公开(公告)号：US10770412B2

公开(公告)日：2020-09-08

申请号：US16109867

申请日：2018-08-23

Applicant: GLOBALFOUNDRIES INC.

Inventor： Nicholas A. Polomoff ,  Andreas D. Stricker ,  Anupam I Arora

IPC: H01L23/58 ,  H01L23/522 ,  H01L23/528 ,  H01L23/00 ,  G02B6/12

Abstract: Embodiments of the disclosure provide a photonic integrated circuit (PIC) die including: a semiconductor substrate; active circuitry on the semiconductor substrate; an inter-level dielectric (ILD) over the semiconductor substrate and the active circuitry; a photonic element extending from the active circuitry on the semiconductor substrate; and a guard ring on the semiconductor substrate and within the ILD, the guard ring surrounding the active circuitry, the guard ring including: a conductive body, and a conductive bridge element extending over the photonic element.