公开(公告)号：US10163673B2

公开(公告)日：2018-12-25

申请号：US14047237

申请日：2013-10-07

Applicant: GLOBALFOUNDRIES INC.

Inventor： Jeffrey P. Gambino ,  Kenneth F. McAvey, Jr. ,  Charles F. Musante ,  Anthony K. Stamper

IPC: H01L21/673 ,  H01L21/683

Abstract: The embodiments of the present invention relate to semiconductor device manufacturing, and more particularly, a method of temporarily bonding a semiconductor wafer to a wafer carrier with a multi-layered contact layer as well as a structure. A method is disclosed that includes: forming a first layer on a surface of a semiconductor wafer; forming a second layer on the first layer; bonding a perforated carrier to the second layer; and removing the semiconductor wafer from the perforated carrier. The first layer may be composed of an adhesive. The second layer may be composed of a material having a higher outgassing temperature than the first layer.