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1.
公开(公告)号:US20180123733A1
公开(公告)日:2018-05-03
申请号:US15336974
申请日:2016-10-28
Applicant: GLOBALFOUNDRIES INC.
IPC: H04L1/00
CPC classification number: H04L1/0052 , H04L1/0043
Abstract: Disclosed are Ethernet physical layer devices (e.g., a transceiver, a receiver and a transmitter) with integrated physical coding and forward error correction sub-layers. Each physical layer device includes a physical coding sub-layer (PCS), a forward error correction sub-layer (FEC) and integration block(s). Each integration block halts, for some number of clock cycles, a data stream in portions of a data path (e.g., portions of a transmitter (TX) data path or portions a receiver (RX) data path) within the PCS and the FEC in order to compensate for processing of that data stream by a data processor (e.g., a code word mark (CWM) inserter or a CWM remover) contained in the portion of the data path within the FEC. Use of such integration block(s) eliminates the need for redundant components in the PCS and FEC, thereby reducing latency, costs and chip area consumption. Also disclosed are associated methods.
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公开(公告)号:US10411832B2
公开(公告)日:2019-09-10
申请号:US15336974
申请日:2016-10-28
Applicant: GLOBALFOUNDRIES INC.
IPC: H04L1/00
Abstract: Disclosed are Ethernet physical layer devices (e.g., a transceiver, a receiver and a transmitter) with integrated physical coding and forward error correction sub-layers. Each physical layer device includes a physical coding sub-layer (PCS), a forward error correction sub-layer (FEC) and integration block(s). Each integration block halts, for some number of clock cycles, a data stream in portions of a data path (e.g., portions of a transmitter (TX) data path or portions a receiver (RX) data path) within the PCS and the FEC in order to compensate for processing of that data stream by a data processor (e.g., a code word mark (CWM) inserter or a CWM remover) contained in the portion of the data path within the FEC. Use of such integration block(s) eliminates the need for redundant components in the PCS and FEC, thereby reducing latency, costs and chip area consumption. Also disclosed are associated methods.
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