公开(公告)号：US20170199511A1

公开(公告)日：2017-07-13

申请号：US14993320

申请日：2016-01-12

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Dongsuk PARK ,  Alok VAID ,  Binod Kumar Gopalakrishn NAIR

IPC: G05B19/4099

CPC classification number: G05B19/4099 ,  G05B2219/32019 ,  G05B2219/32104 ,  G05B2219/45031

Abstract: Methodologies and a device for simulating individual process steps and producing parameters representing each individual process signal profile are provided. Embodiments include collecting, by way of a programmed processor, wafer level data in the form of electrical signatures during processing steps in the production of a semiconductor device; converting the electrical signatures during each of the processing steps into signal matrix (MS) modeling parameters; comparing the MS modeling parameters to predefined MS modeling parameters; and adjusting at least one processing step based on a result of the comparing step for process control.