公开(公告)号：US20200075513A1

公开(公告)日：2020-03-05

申请号：US16118791

申请日：2018-08-31

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Marcel Wieland ,  Christian Goetze

IPC: H01L23/66 ,  H01L23/498 ,  H01L23/00

Abstract: RF semiconductor chips may be packaged on wafer level on the basis of a two-step process for providing a package material, thereby providing very short electrical connections between antenna structures formed in the package material and the semiconductor chip. In some illustrative embodiments, the antenna structures may be provided above the semiconductor chip, which results in a very space-efficient overall configuration.

公开(公告)号：US10580745B1

公开(公告)日：2020-03-03

申请号：US16118791

申请日：2018-08-31

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Marcel Wieland ,  Christian Goetze

IPC: H01L21/00 ,  H01L23/66 ,  H01L23/498 ,  H01L23/00

Abstract: RF semiconductor chips may be packaged on wafer level on the basis of a two-step process for providing a package material, thereby providing very short electrical connections between antenna structures formed in the package material and the semiconductor chip. In some illustrative embodiments, the antenna structures may be provided above the semiconductor chip, which results in a very space-efficient overall configuration.