公开(公告)号：US10115621B2

公开(公告)日：2018-10-30

申请号：US15153936

申请日：2016-05-13

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Peter Moll ,  Martin Schmidt ,  Carsten Hartig ,  Matthias Ruhm ,  Stefan Thierbach ,  Stefan Rongen ,  Daniel Fischer ,  Andreas Schuring ,  Guido Überreiter

IPC: H01L21/68 ,  H01L23/544 ,  G03F7/20 ,  G03F9/00 ,  H01L21/66

Abstract: Methods for in-die overlay reticle measurement and the resulting devices are disclosed. Embodiments include providing parallel structures in a first layer on a substrate; determining measurement sites, in a second layer above the first layer, void of active integrated circuit elements; forming overlay trenches, in the measurement sites and parallel to the structures, exposing sections of the structures, wherein each overlay trench is aligned over a structure and over spaces between the structure and adjacent structures; determining a trench center-of-gravity of an overlay trench; determining a structure center-of-gravity of a structure exposed in the overlay trench; and determining an overlay parameter based on a difference between the trench center-of-gravity and the structure center-of-gravity.