公开(公告)号：US09588044B2

公开(公告)日：2017-03-07

申请号：US14800940

申请日：2015-07-16

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Sabarinath Jayaseelan ,  Suraj Kumar Patil

IPC: G01N21/552 ,  G01N21/95

CPC classification number: G01N21/553 ,  G01N21/9501 ,  G01N21/95684

Abstract: A method and apparatus are provided for using SPR to detect buried voids in a semiconductor wafer inline post metal deposition. Embodiments include forming a first, a second, and a third metal structure in a first, a second, and a third adjacent die of a wafer; performing a SPR on the first, second, and third metal structures inline; detecting a first, a second, and a third SPR wavelength corresponding to the first, second, and third metal structures, respectively; comparing a difference between the first SPR wavelength and the second SPR wavelength and a difference between the third SPR wavelength and the first SPR wavelength against a threshold value; and determining a presence or an absence of a buried void in the first metal structure based on the comparison.

Abstract translation: 提供了一种使用SPR来检测半导体晶片在线后金属沉积中的掩埋空隙的方法和装置。 实施例包括在晶片的第一，第二和第三相邻晶片中形成第一，第二和第三金属结构; 在第一，第二和第三金属结构上进行SPR; 检测分别对应于第一，第二和第三金属结构的第一，第二和第三SPR波长; 将第一SPR波长和第二SPR波长之间的差与第三SPR波长与第一SPR波长之间的差相对于阈值进行比较; 以及基于所述比较来确定所述第一金属结构中存在或不存在所述掩埋空隙。