公开(公告)号：US09899324B1

公开(公告)日：2018-02-20

申请号：US15362499

申请日：2016-11-28

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Shafaat Ahmed ,  Sadanand Vinayak Despande ,  Atsushi Ogino

IPC: H01L23/528 ,  H01L23/544 ,  H01L23/522 ,  H01L23/532 ,  H01L21/768 ,  H01L23/00

CPC classification number: H01L21/76879 ,  H01L23/53238 ,  H01L23/562 ,  H01L23/585 ,  H01L2223/5446

Abstract: A method includes providing a semiconductor substrate having horizontal and vertical scribe lines thereon defining semiconductor areas for printed circuits and/or semiconductor devices, and forming a metallic structure on the semiconductor substrate to serve as a bus bar for the printed circuits and/or semiconductor devices. A semiconductor structure is realized with the method, the semiconductor structure including a semiconductor substrate having horizontal and vertical scribe lines thereon defining semiconductor areas for printed circuits and/or semiconductor devices, a metallic structure on the semiconductor substrate serving as a bus bar for the printed circuits and/or semiconductor devices, and printed circuits and/or semiconductor devices in the semiconductor areas.