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公开(公告)号：US20220137292A1
公开(公告)日：2022-05-05
申请号：US17084186
申请日：2020-10-29
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor： Yusheng BIAN , Siva P. ADUSUMILLI , Bo PENG , Kenneth J. GIEWONT
Abstract: The present disclosure relates to semiconductor structures and, more particularly, to grating couplers integrated with one or more airgap and methods of manufacture. The structure includes: a substrate material comprising one or more airgaps; and a grating coupler disposed over the substrate material and the one or more airgaps.
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