公开(公告)号：US09295184B2

公开(公告)日：2016-03-22

申请号：US14094066

申请日：2013-12-02

Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC

Inventor： Mark D. Korich ,  Vicentiu Grosu ,  David Tang ,  Gregory S. Smith ,  Konstantinos Triantos

IPC: H05K5/00 ,  H05K7/00 ,  H05K7/20 ,  H05K7/14

CPC classification number: H05K7/209 ,  H05K7/1432 ,  Y10T29/49117

Abstract: A power electronic building block includes a housing; a power module mounted within the housing; a controller mounted within the housing and coupled to the power module; a capacitor assembly coupled to the power module and mounted within the housing; an AC bus bar mounted within the housing; and a DC bus bar coupling the capacitor assembly to the power module and mounted within the housing.

Abstract translation: 电力电子构建块包括壳体; 安装在所述壳体内的功率模块; 安装在所述壳体内并耦合到所述功率模块的控制器; 耦合到所述功率模块并安装在所述壳体内的电容器组件; 安装在壳体内的AC母线; 以及将电容器组件耦合到功率模块并且安装在壳体内的DC母线。