公开(公告)号：US11689857B2

公开(公告)日：2023-06-27

申请号：US17454401

申请日：2021-11-10

Applicant: GN Audio A/S

Inventor： Frank Lin ,  Seven Huang ,  Alice Lin ,  Jon Grane Madsen ,  Bill Zeng

IPC: H04R5/033

CPC classification number: H04R5/0335

Abstract: A headband for a headset and a method for producing the headband for the headset is disclosed. The headband is configured to carry at least one earcup of the headset. The headband comprises a carrier and a rubber suspension formed by overmolding. The method comprising the steps of providing the carrier, arranging the carrier in an injection molding tool, and forming the suspension from a rubber material by overmolding such that the suspension forms at least two attachment points to the carrier.