公开(公告)号：US20220210533A1

公开(公告)日：2022-06-30

申请号：US17454421

申请日：2021-11-10

Applicant: GN Audio A/S

Inventor： Frank LIN ,  Seven HUANG ,  Jon Grane MADSEN ,  Bill Grane ZENG ,  Jack ZHAO

IPC: H04R1/10

Abstract: The disclosure relates to a headband for a headset, the headband comprising a first strip and a second strip detachably assembled together. The first strip comprises at least one through opening and the second strip is detachably connected via the through opening to the first strip as a cover. The second strip comprises first and second parts at least partly covering the first strip. The disclosure further relates to a headset comprising a headband and a method for assembly of a headband for a headset.

公开(公告)号：US20230066274A1

公开(公告)日：2023-03-02

申请号：US18047540

申请日：2022-10-18

Applicant: GN Audio A/S

Inventor： Frank LIN ,  Seven HUANG ,  Alice LIN ,  Jon Grane MADSEN ,  Bill ZENG

IPC: H04R5/033

Abstract: A headband for a headset and a method for producing the headband for the headset is disclosed. The headband is configured to carry at least one earcup of the headset. The headband comprises a carrier and a rubber suspension formed by overmolding. The method comprising the steps of providing the carrier, arranging the carrier in an injection molding tool, and forming the suspension from a rubber material by overmolding such that the suspension forms at least two attachment points to the carrier.

公开(公告)号：US20220210560A1

公开(公告)日：2022-06-30

申请号：US17454401

申请日：2021-11-10

Applicant: GN Audio A/S

Inventor： Frank LIN ,  Seven HUANG ,  Alice LIN ,  Jon Grane MADSEN ,  Bill ZENG

IPC: H04R5/033

Abstract: A headband for a headset and a method for producing the headband for the headset is disclosed. The headband is configured to carry at least one earcup of the headset. The headband comprises a carrier and a rubber suspension formed by overmolding. The method comprising the steps of providing the carrier, arranging the carrier in an injection molding tool, and forming the suspension from a rubber material by overmolding such that the suspension forms at least two attachment points to the carrier.