Sound absorbing assembly for speaker module and speaker module

    公开(公告)号:US10701475B2

    公开(公告)日:2020-06-30

    申请号:US16098678

    申请日:2016-12-29

    Applicant: Goertek Inc.

    Abstract: A sound absorbing assembly for a loudspeaker module and a loudspeaker module are disclosed. The sound absorbing assembly comprises a holding shell, the holding shell is provided with a receiving trough, the receiving trough is filled with a sound absorbing material, the holding shell is fixed within a rear vocal cavity of the loudspeaker module by injection molding, a bottom of the receiving trough is provided with sound penetration holes, and an interior of the receiving trough communicates with the rear vocal cavity via the sound penetration holes. The sound absorbing assembly is provided with a receiving trough on the holding shell, and the sound penetration holes of the receiving trough form sound transmission channels, to enable the sound absorbing material placed within the receiving trough to perform the sound absorbing function, to improve the acoustic quality of the loudspeaker.

    Miniature loudspeaker module
    2.
    发明授权

    公开(公告)号:US11317195B2

    公开(公告)日:2022-04-26

    申请号:US17058786

    申请日:2018-12-29

    Applicant: GOERTEK INC.

    Abstract: Disclosed is a miniature speaker module. The module includes: a module housing and a speaker unit, wherein the speaker unit divides an inner space of the module housing into a front sound cavity and a rear sound cavity. The module housing includes a side wall and a bottom wall connected to the side wall, in which side wall being provided a sound outlet hole. The module housing further includes a supporting platform arranged in a cavity enclosed by the side wall and the bottom wall, and a partition wall connected to the supporting platform, wherein the partition wall and the bottom wall are parallel and oppositely arranged one above another. The speaker unit is mounted on the supporting platform. The speaker unit, the supporting platform and the partition wall constitute the front sound cavity, wherein the front sound cavity is in communication with the sound outlet hole.

    Sound Absorbing Assembly for Speaker Module and Speaker Module

    公开(公告)号:US20190141436A1

    公开(公告)日:2019-05-09

    申请号:US16098678

    申请日:2016-12-29

    Applicant: Goertek Inc.

    Abstract: A sound absorbing assembly for a loudspeaker module and a loudspeaker module are disclosed. The sound absorbing assembly comprises a holding shell, the holding shell is provided with a receiving trough, the receiving trough is filled with a sound absorbing material, the holding shell is fixed within a rear vocal cavity of the loudspeaker module by injection molding, a bottom of the receiving trough is provided with sound penetration holes, and an interior of the receiving trough communicates with the rear vocal cavity via the sound penetration holes. The sound absorbing assembly is provided with a receiving trough on the holding shell, and the sound penetration holes of the receiving trough form sound transmission channels, to enable the sound absorbing material placed within the receiving trough to perform the sound absorbing function, to improve the acoustic quality of the loudspeaker.

    MINIATURE LOUDSPEAKER MODULE
    4.
    发明申请

    公开(公告)号:US20210204055A1

    公开(公告)日:2021-07-01

    申请号:US17058786

    申请日:2018-12-29

    Applicant: GOERTEK INC.

    Abstract: Disclosed is a miniature speaker module. The module includes: a module housing and a speaker unit, wherein the speaker unit divides an inner space of the module housing into a front sound cavity and a rear sound cavity. The module housing includes a side wall and a bottom wall connected to the side wall, in which side wall being provided a sound outlet hole. The module housing further includes a supporting platform arranged in a cavity enclosed by the side wall and the bottom wall, and a partition wall connected to the supporting platform, wherein the partition wall and the bottom wall are parallel and oppositely arranged one above another. The speaker unit is mounted on the supporting platform. The speaker unit, the supporting platform and the partition wall constitute the front sound cavity, wherein the front sound cavity is in communication with the sound outlet hole.

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