公开(公告)号：US09883266B2

公开(公告)日：2018-01-30

申请号：US15108255

申请日：2014-04-28

Applicant: GOERTEK INC.

Inventor： Zhigan Dai ,  Di Wu ,  Huiyu Li ,  Xinfeng Yang

IPC: H04R1/02 ,  H04R9/06 ,  H04R1/28 ,  H04R1/38 ,  H04R31/00

CPC classification number: H04R1/021 ,  H04R1/025 ,  H04R1/2811 ,  H04R1/2819 ,  H04R1/288 ,  H04R1/38 ,  H04R9/06 ,  H04R31/006 ,  H04R2499/11

Abstract: A loudspeaker module comprises a loudspeaker unit and a module housing. A front acoustic cavity and a rear acoustic cavity are formed between the module housing and the loudspeaker unit. The upper and lower ends of the front acoustic cavity and the rear acoustic cavity are open. The upper and lower end surfaces of the module housing are combined with a terminal electronic device through sealing cushions. An electronic device is also disclosed. The upper and lower surfaces of the module housing are combined with the circuit board or the device housing through sealing cushions. Such a structure fully utilizes the spaces of the loudspeaker module and the electronic device, expands the internal space of the loudspeaker module, increases the sizes of the loudspeaker unit and the sound cavities, and accordingly improves the acoustical performance of the product.

公开(公告)号：US20160323675A1

公开(公告)日：2016-11-03

申请号：US15108255

申请日：2014-04-28

Applicant: GOERTEK INC.

Inventor： Zhigan Dai ,  Di Wu ,  Huiyu Li ,  Xinfeng Yang

IPC: H04R9/06 ,  H04R1/38 ,  H04R1/28

CPC classification number: H04R1/021 ,  H04R1/025 ,  H04R1/2811 ,  H04R1/2819 ,  H04R1/288 ,  H04R1/38 ,  H04R9/06 ,  H04R31/006 ,  H04R2499/11

Abstract: A loudspeaker module comprises a loudspeaker unit and a module housing. A front acoustic cavity and a rear acoustic cavity are formed between the module housing and the loudspeaker unit. The upper and lower ends of the front acoustic cavity and the rear acoustic cavity are open. The upper and lower end surfaces of the module housing are combined with a terminal electronic device through sealing cushions. An electronic device is also disclosed. The upper and lower surfaces of the module housing are combined with the circuit board or the device housing through sealing cushions. Such a structure fully utilizes the spaces of the loudspeaker module and the electronic device, expands the internal space of the loudspeaker module, increases the sizes of the loudspeaker unit and the sound cavities, and accordingly improves the acoustical performance of the product.

Abstract translation: 扬声器模块包括扬声器单元和模块壳体。 在模块壳体和扬声器单元之间形成前声腔和后声腔。 前声腔和后声腔的上下端是开放的。 模块外壳的上端和下端表面通过密封垫与终端电子设备组合。 还公开了一种电子设备。 模块外壳的上表面和下表面通过密封垫与电路板或设备外壳结合。 这种结构充分利用了扬声器模块和电子设备的空间，扩展了扬声器模块的内部空间，增加了扬声器单元和声腔的尺寸，从而提高了产品的声学性能。