公开(公告)号：US20240205594A1

公开(公告)日：2024-06-20

申请号：US18591663

申请日：2024-02-29

Applicant: GOERTEK TECHNOLOGY CO., LTD.

Inventor： Jinbao Li ,  Jinguo Zhang

IPC: H04R1/40 ,  H04R1/02 ,  H04R7/04

CPC classification number: H04R1/403 ,  H04R1/025 ,  H04R7/04 ,  H04R2499/11

Abstract: A speaker module and a head-mounted device are disclosed. The speaker module includes a bracket, a first speaker fixedly provided on a first surface of the bracket and a second speaker fixedly provided on a second surface of the bracket, and the first surface and the second surface are non-coplanar. The first speaker has a first diaphragm with a first rear sound cavity on one side thereof proximate to the bracket, and the first speaker has a first sound leakage hole in communication with the first rear sound cavity, and a centerline of the first sound leakage hole is parallel to the first surface of the bracket. The second speaker has a second diaphragm with a second rear sound cavity on one side thereof proximate to the bracket.

公开(公告)号：US20240265905A1

公开(公告)日：2024-08-08

申请号：US18589906

申请日：2024-02-28

Applicant: GOERTEK TECHNOLOGY CO., LTD.

Inventor： Jinbao Li ,  Jinguo Zhang

IPC: G10K11/178 ,  G10K11/00 ,  H04R1/02

CPC classification number: G10K11/1781 ,  G10K11/002 ,  G10K11/17853 ,  H04R1/025 ,  H04R1/028

Abstract: The present disclosure provides a speaker device, head-mounted device, and signal processing method. The speaker device includes: a first housing and a first speaker unit, the first speaker unit being provided inside the first housing and separating the first housing into a first front sound cavity and a first rear sound cavity; the first housing is opened thereon with at least one first sound emission holes and at least one first sound leakage holes, the first sound emission holes being in communication with the first front sound cavity, and the first sound leakage holes being in communication with the first rear sound cavity.