OVERMOLDING AND OVERCASTING FOR ENCAPSULATING POLYMER REFLECTIVE WAVEGUIDE

    公开(公告)号:US20250035836A1

    公开(公告)日:2025-01-30

    申请号:US18226069

    申请日:2023-07-25

    Applicant: GOOGLE LLC

    Abstract: Overmolding or overcasting one portion of a reflective waveguide to another portion achieves bonding of components of the reflective waveguide without the need for an index-matched adhesive or an alignment platform for bonding. In embodiments in which one portion is overmolded to the other, the materials used to form the portions are selected such that the material used to form a first portion has a glass transition temperature (Tg) that is higher than the Tg of the material used to form a second portion. In embodiments in which one portion is overcasted to the other, the materials used to form the first portion and the second portion are thermosetting resins and are selected such that both materials have solubility parameters that approximately match each other.

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