公开(公告)号：US4745002A

公开(公告)日：1988-05-17

申请号：US802412

申请日：1985-11-27

申请人： Gavriel L. Vexler ,  B. Paul S. Cheema

发明人： Gavriel L. Vexler ,  B. Paul S. Cheema

IPC分类号： C23C4/12 ,  C23C24/10 ,  H01B1/02 ,  B05D3/06 ,  B05D1/24

CPC分类号： C23C24/106 ,  C23C4/12 ,  H01B1/026

摘要： Method of making copper clad conductor by impinging of copper particles upon a heated steel wire to cause adhesion of the particles to the wire, by coalescence, building up the particles to form a coating and then drawing the coated wire to the required diameter. The coated wire may be heat treated to cause flow of copper to improve the surface finish before the drawing process. The copper particles may be directed at the wire by a spraying technique. Alternatively, the wire is passed over a fluidized bed of the particles and through a cloud of particles thrown up by the bed.

摘要翻译： 通过将铜颗粒撞击在加热的钢丝上以使颗粒粘附到丝线上，通过聚结来制造铜包层导体的方法，建立颗粒以形成涂层，然后将涂覆的线拉成所需直径。 涂覆的线材可以被热处理以引起铜的流动，以在拉伸过程之前改善表面光洁度。 铜颗粒可以通过喷涂技术引导到导线上。 或者，电线穿过颗粒的流化床并通过由床抛出的颗粒云。