公开(公告)号：US20230284391A1

公开(公告)日：2023-09-07

申请号：US18019104

申请日：2021-07-15

申请人： Gebr. Schmid GmbH

发明人： Christian Buchner ,  Jürgen Haungs ,  Christian Schmid

IPC分类号： H05K3/06

CPC分类号： H05K3/062 ,  H05K2203/107

摘要： A method of producing a printed circuit board includes providing a base substrate that is a film or plate, has first and second substrate sides and consists partly of an electrically non-conducting organic polymer material, where the first substrate side is covered with a capping metal layer, and regionally removing the capping metal layer, wherein regionally removing the capping metal layer includes applying a mask layer to the capping metal layer, regionally removing the mask layer by a laser so that the first substrate side is divided into at least one first subregion, in which the first substrate side is covered only with the capping metal layer, and into at least one second subregion, in which the first substrate side is covered with the capping metal layer and by the mask layer, and removing the capping metal layer in the at least one first subregion by an etching solution.