公开(公告)号：US20180337109A1

公开(公告)日：2018-11-22

申请号：US15981975

申请日：2018-05-17

Applicant: General Electric Company

Inventor： Saijun MAO ,  Bo QU ,  Jingkui SHI ,  He XU ,  Jie SHEN ,  Lin LAN ,  Rui LI ,  Zhihui YUAN ,  Alistair Martin WADDELL ,  Stefan SCHROEDER ,  Marius Michael MECHLINSKI ,  Mark Aaron CHAN

IPC: H01L23/473 ,  H01L23/367 ,  H01L25/07

CPC classification number: H01L23/473 ,  H01L25/072

Abstract: The present disclosure relates to an integrated power semiconductor packaging apparatus and a power converter containing the integrated power semiconductor packaging apparatus. The integrated power semiconductor packaging apparatus comprises a plurality of power semiconductor devices and an electrically insulative substrate formed integrally. The electrically insulative substrate comprises a flat surface, at least one separation wall protruding from the flat surface and a flow channel inside the electrically insulative substrate. The at least one separation wall is configured to separate the flat surface into a plurality of flat areas, and each of the plurality of flat areas is configured to receive one of the plurality of power semiconductor devices. The flow channel is configured for allowing a coolant flowing through to remove heat from the plurality of power semiconductor devices.