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公开(公告)号：US10746667B2
公开(公告)日：2020-08-18
申请号：US16201322
申请日：2018-11-27
Applicant: General Electric Company
Inventor： Xiao Bian , John Karigiannis , Stephane Harel , Steeves Bouchard , Maxime Beaudoin Pouliot , Wayne Grady , David Scott Diwinsky , Bernard Patrick Bewlay
Abstract: An inspection system includes an imaging device, visible light source, ultraviolet light source, and at least one processor. The imaging device generates a first image set of a work piece while the ultraviolet light source illuminates the work piece with ultraviolet light to cause fluorescent dye thereon to emit light, and generates a second image set of the work piece while the visible light source illuminates the work piece with visible light. The first and second image sets are generated at the same positions of the imaging device relative to the work piece. The processor maps the second image set to a computer design model of the work piece based on features depicted in the second image set and the positions of the imaging device. The processor determines a defect location on the work piece based on an analysis of the first image set and the computer design model.
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公开(公告)号：US20200166467A1
公开(公告)日：2020-05-28
申请号：US16201322
申请日：2018-11-27
Applicant: General Electric Company
Inventor： Xiao Bian , John Karigiannis , Stephane Harel , Steeves Bouchard , Maxime Beaudoin Pouliot , Wayne Grady , David Scott Diwinsky , Bernard Patrick Bewlay
Abstract: An inspection system includes an imaging device, visible light source, ultraviolet light source, and at least one processor. The imaging device generates a first image set of a work piece while the ultraviolet light source illuminates the work piece with ultraviolet light to cause fluorescent dye thereon to emit light, and generates a second image set of the work piece while the visible light source illuminates the work piece with visible light. The first and second image sets are generated at the same positions of the imaging device relative to the work piece. The processor maps the second image set to a computer design model of the work piece based on features depicted in the second image set and the positions of the imaging device. The processor determines a defect location on the work piece based on an analysis of the first image set and the computer design model.
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