Heat transfer system for electronic enclosures
    10.
    发明授权
    Heat transfer system for electronic enclosures 失效
    电子外壳传热系统

    公开(公告)号:US5762550A

    公开(公告)日:1998-06-09

    申请号:US697234

    申请日:1996-08-21

    申请人: Robert D. Brunner

    发明人: Robert D. Brunner

    IPC分类号: F24F13/08 H05K7/20

    CPC分类号: H05K7/20136

    摘要: A housing for an electronic device having an air circulation device. The housing includes an enclosure with a plurality of panels. One of the panels includes an air inlet port and an air outlet port. The air inlet port and the air outlet port are spaced from each other. The air inlet port and the air outlet port have openings in the first panel and a plurality of generally parallel vanes located in respective opening to pull air into, or exhaust air from, the enclosure. The vanes of the air inlet port and the air outlet port are angled in opposite directions to minimize the recirculation of exhausted air back into the air inlet.

    摘要翻译: 一种具有空气循环装置的电子装置的壳体。 壳体包括具有多个面板的外壳。 其中一个面板包括进气口和出气口。 进气口和空气出口彼此间隔开。 空气入口和空气出口在第一面板中具有开口,并且在相应的开口中具有多个大致平行的叶片,以将空气从壳体中吸入或排出空气。 空气入口和空气出口的叶片在相反的方向上成角度,以使得排出的空气再循环到空气入口中。