公开(公告)号：US20190148441A1

公开(公告)日：2019-05-16

申请号：US16185023

申请日：2018-11-09

Applicant: Goldtek Technology Co., Ltd.

Inventor： LI-JEN LIU

IPC: H01L27/146 ,  H01L23/498 ,  H04N5/225 ,  A61B1/00 ,  A61B1/05 ,  A61B90/20

Abstract: A micro endoscope device comprises: a wafer level image capturing module, which includes a light receiving terminal configured to receive light input, thereby enabling generation of an image signal and conversion of the image signal into plurality of electric signals, and a signal in/output terminal having a plurality of electrical contacts and configured to output the electric signals; a first interposer that includes a first substrate and a plurality of electrical contacts, the first substrate having a plurality of holes defined thereon; a second interposer that includes a second substrate and a plurality of electrical contacts, the second substrate having a plurality of holes defined thereon; a micro-coaxial cable comprising a plurality of micro-wires; wherein the wafer level image capturing module is coupled to the first interposer, the first interposer is coupled to the second interposer, and the second interposer is coupled to the micro-coaxial cable.