公开(公告)号：US20250097331A1

公开(公告)日：2025-03-20

申请号：US18571113

申请日：2022-12-16

Applicant: Google LLC

Inventor： Trevor Matthew Cardiff ,  Charles Barnard Woodhull ,  Warren Zachary Jones ,  Kliulai Chow-Yee ,  Joseph L. Allore ,  James Leonard Tanner

IPC: H04M1/02

Abstract: Techniques and apparatuses are described that implement housing assemblies for computing devices. In aspects, a housing assembly includes an elongated side-frame element comprising a first metal and a cast internal frame comprising a second, different, metal. The melting point of the first metal is higher than the melting point of the second metal. The elongated side-frame element may include at least one elongated slot disposed on an inner surface of the elongated side-frame element, with the elongated slot oriented parallel to the elongated side-frame element. The slot may include at least one undercut. The cast internal frame may include an elongated interlock flange that extends from an internal frame body. The elongated interlock flange received into the elongated slot of the elongated side-frame element. This document also describes methods for manufacturing a computing device housing assembly and a product-by-process.