公开(公告)号：US20230114700A1

公开(公告)日：2023-04-13

申请号：US17962144

申请日：2022-10-07

Applicant: Google LLC

Inventor： Brian James Burkett ,  John Mark Kreikebaum

IPC: H01L21/308 ,  H01L21/324 ,  H01L21/02 ,  H01L21/3205

Abstract: A substrate, a first layer disposed on the substrate, and a second layer disposed on the first layer are provided. An opening is etched through the second layer to the first layer. A first portion of the first layer is etched through the opening using a first etchant, to expose a surface of the substrate through the opening. A feature is deposited on the surface of the substrate through the opening. A second portion of the first layer is etched using a gaseous etchant, to release the substrate from the second layer.