公开(公告)号：US20240395453A1

公开(公告)日：2024-11-28

申请号：US18798347

申请日：2024-08-08

Applicant: Google LLC

Inventor： Chenhao Nan ,  Houle Gan ,  Runruo Chen ,  Qiong Wang ,  Xin Li

IPC: H01F27/28 ,  H01F27/06 ,  H01F27/24

Abstract: The subject matter described herein provides systems and techniques for the integration of TLVR technology in a vertical power VR module. A multiple-secondary TLVR topology using a controlled leakage inductance in the place of a separate compensation inductor, Lc, may be employed for the vertical power VR module. In addition, the capacitance inside the device to which the TLVR based vertical power VR module supplies power, rather than an output capacitance board, may be used in order to allow the module to be a single layer. Example structures that may include one or more primary windings and/or one or more secondary windings for each of possibly multiple linked phases of the TLVR based module are provided. The windings may be formed using traditional copper windings or printed circuit board (PCB) copper trace winding.

公开(公告)号：US12159738B2

公开(公告)日：2024-12-03

申请号：US17358354

申请日：2021-06-25

Applicant: Google LLC

Inventor： Chenhao Nan ,  Houle Gan ,  Runruo Chen ,  Qiong Wang ,  Xin Li

IPC: H01F27/28 ,  H01F27/06 ,  H01F27/24

Abstract: The subject matter described herein provides systems and techniques for the integration of TLVR technology in a vertical power VR module. A multiple-secondary TLVR topology using a controlled leakage inductance in the place of a separate compensation inductor, Lc, may be employed for the vertical power VR module. In addition, the capacitance inside the device to which the TLVR based vertical power VR module supplies power, rather than an output capacitance board, may be used in order to allow the module to be a single layer. Example structures that may include one or more primary windings and/or one or more secondary windings for each of possibly multiple linked phases of the TLVR based module are provided. The windings may be formed using traditional copper windings or printed circuit board (PCB) copper trace winding.

公开(公告)号：US20220415558A1

公开(公告)日：2022-12-29

申请号：US17358354

申请日：2021-06-25

Applicant: Google LLC

Inventor： Chenhao Nan ,  Houle Gan ,  Runruo Chen ,  Qiong Wang ,  Xin Li

IPC: H01F27/28 ,  H01F27/06 ,  H01F27/24

Abstract: The subject matter described herein provides systems and techniques for the integration of TLVR technology in a vertical power VR module. A multiple-secondary TLVR topology using a controlled leakage inductance in the place of a separate compensation inductor, Lc, may be employed for the vertical power VR module. In addition, the capacitance inside the device to which the TLVR based vertical power VR module supplies power, rather than an output capacitance board, may be used in order to allow the module to be a single layer. Example structures that may include one or more primary windings and/or one or more secondary windings for each of possibly multiple linked phases of the TLVR based module are provided. The windings may be formed using traditional copper windings or printed circuit board (PCB) copper trace winding.