公开(公告)号：US08338201B2

公开(公告)日：2012-12-25

申请号：US13019287

申请日：2011-02-01

Applicant: Gopalan Rajeswaran ,  Rajeev Jindal ,  Subrata Dutta

Inventor： Gopalan Rajeswaran ,  Rajeev Jindal ,  Subrata Dutta

IPC: H01L21/00

CPC classification number: H01L51/0024 ,  H01L51/5259

Abstract: A method of manufacturing an organic lighting device, having a form factor substantially equal to or less than 900 square centimeters, without involving a cutting process is provided. The method includes providing one or more first substrates with a size substantially equal to the form factor. Thereafter, the method includes a high throughput first processing of the one or more first substrates and active layer deposition processing on the one or more first substrates. Further, one or more second substrates having a size substantially equal or less than the form factor are provided. Thereafter, a high throughput second processing is performed on the one or more second substrates. Finally, the method includes encapsulating at least one of the one or more first substrates with at least one of the one or more second substrates to form the organic lighting device having the form factor.

Abstract translation: 提供一种制造有机照明装置的方法，其具有基本上等于或小于900平方厘米的形状因数，而不涉及切割过程。 该方法包括提供具有基本上等于形状因子的尺寸的一个或多个第一基底。 此后，该方法包括一个或多个第一基板的高通量第一处理和一个或多个第一基板上的有源层沉积处理。 此外，提供具有基本上等于或小于形状因子的尺寸的一个或多个第二基板。 此后，对一个或多个第二基板执行高吞吐量第二处理。 最后，该方法包括用一个或多个第二基板中的至少一个封装一个或多个第一基板中的至少一个，以形成具有形状因子的有机照明装置。

公开(公告)号：US20100254251A1

公开(公告)日：2010-10-07

申请号：US12557720

申请日：2009-09-11

Applicant: Sanjay Kumar ,  Giriraj Nyati ,  Subrata Dutta ,  Rajeev Jindal

Inventor： Sanjay Kumar ,  Giriraj Nyati ,  Subrata Dutta ,  Rajeev Jindal

IPC: G11B7/26

CPC classification number: G03H1/02 ,  B65B7/2835 ,  B65B25/00 ,  G03H2250/37 ,  G03H2270/22 ,  G03H2270/54 ,  G11B7/24044 ,  G11B7/26 ,  Y10T29/49826

Abstract: An article involving encapsulation of one or more hygroscopic materials and manufacturing method and system thereof are provided. The article includes a first substrate, a second substrate, one or more first structures formed at a first periphery associated with the first substrate, and one or more second structures formed at a second periphery associated with the second substrate. The first structures and the second structures are engaged together mechanically to form an enclosure between the first substrate and the second substrate. The enclosure is capable of preventing exposure of a hygroscopic material encapsulated between the first substrate and the second substrate to the surrounding environment.

Abstract translation: 提供一种涉及一种或多种吸湿材料的封装的制品及其制造方法和系统。 所述制品包括第一衬底，第二衬底，在与所述第一衬底相关联的第一周边处形成的一个或多个第一结构以及形成在与所述第二衬底相关联的第二周边处的一个或多个第二结构。 第一结构和第二结构机械地接合在一起，以在第一基板和第二基板之间形成外壳。 外壳能够防止将包封在第一基板和第二基板之间的吸湿材料暴露于周围环境。

公开(公告)号：US20070048483A1

公开(公告)日：2007-03-01

申请号：US11214609

申请日：2005-08-29

Applicant: Douglas Stinson ,  Abhirup De ,  Rajeev Jindal ,  Subrata Dutta ,  Brian Bartholomeusz ,  Giriraj Nyati

Inventor： Douglas Stinson ,  Abhirup De ,  Rajeev Jindal ,  Subrata Dutta ,  Brian Bartholomeusz ,  Giriraj Nyati

IPC: B32B3/02

CPC classification number: G11B7/252 ,  G11B7/2534 ,  Y10T428/21

Abstract: A radiation image-able data storage medium according to one exemplary embodiment is provided in the present disclosure that includes a substrate having at least one diffractive feature formed on a surface of the substrate. The radiation image-able data storage medium may also include a radiation-sensitive layer that may be coupled to the substrate.

Abstract translation: 在本公开内容中提供了根据一个示例性实施例的可放射成像的数据存储介质，其包括具有形成在基板的表面上的至少一个衍射特征的基板。 可辐射成像数据存储介质还可以包括可耦合到衬底的辐射敏感层。