SENSOR ASSEMBLY
    1.
    发明申请
    SENSOR ASSEMBLY 审中-公开

    公开(公告)号:US20170328746A1

    公开(公告)日:2017-11-16

    申请号:US15533183

    申请日:2015-08-28

    CPC classification number: G01D11/245 G12B9/04

    Abstract: A sensor arrangement includes at least one sensor (7) as well as a housing (1) constructed of at least two plastic injection molded parts (2, 3), and a sensor electronics which are located on the circuit board (5) and which is secured by this housing. At least one absorption body (4) is provided within the housing (1) and is designed as a plastic injection molded part and serves for absorbing fluid which could get into the housing by diffusion.

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