公开(公告)号：US11101226B2

公开(公告)日：2021-08-24

申请号：US16282304

申请日：2019-02-22

申请人： Guy Koren ,  Ben Rubovitch

发明人： Guy Koren ,  Ben Rubovitch

IPC分类号： H01L23/66 ,  H01L23/367 ,  H01L23/00

摘要： A method and a high-frequency module that includes a high frequency die that may include multiple die pads; a substrate that may include a first buildup layer, a second buildup layer and a core that is positioned between the first buildup layer and a second buildup layer; a line card that may include multiple line card pads; and multiple conductors that pass through the substrate without reaching a majority of a depth of the core, and couple the multiple die pads to the multiple line card pads.

公开(公告)号：US20200273821A1

公开(公告)日：2020-08-27

申请号：US16282304

申请日：2019-02-22

申请人： Guy Koren ,  Ben Rubovitch

发明人： Guy Koren ,  Ben Rubovitch

IPC分类号： H01L23/66 ,  H01L23/367 ,  H01L23/00

摘要： A method and a high-frequency module that includes a high frequency die that may include multiple die pads; a substrate that may include a first buildup layer, a second buildup layer and a core that is positioned between the first buildup layer and a second buildup layer; a line card that may include multiple line card pads; and multiple conductors that pass through the substrate without reaching a majority of a depth of the core, and couple the multiple die pads to the multiple line card pads.

公开(公告)号：US10985118B2

公开(公告)日：2021-04-20

申请号：US16282306

申请日：2019-02-22

申请人： Guy Koren ,  Ben Rubovitch

发明人： Guy Koren ,  Ben Rubovitch

IPC分类号： H01L23/66 ,  H01L23/498 ,  H01L23/367 ,  H01L23/00

摘要： A method and a high-frequency module that includes (a) a high frequency die that includes multiple die pads, (b) a substrate that comprises a first buildup layer, a second buildup layer and a core that is positioned between the first buildup layer and a second buildup layer, (c) a heat sink and coupling module that comprises a heat sink and multiple first conductors that pass through the heat sink and extend outside the heat sink; (d) a line card that comprises multiple line card pads that are coupled to external ends of the multiple first conductors; (e) coupling elements that are coupled to internal end of the multiple first conductors; and (f) multiple second conductors that pass through the substrate without reaching a majority of a depth of the core, and couple the multiple die pads to the coupling elements. The high frequency it not lower than fifty gigabits per second.

公开(公告)号：US20200273822A1

公开(公告)日：2020-08-27

申请号：US16282306

申请日：2019-02-22

申请人： Guy Koren ,  Ben Rubovitch

发明人： Guy Koren ,  Ben Rubovitch

IPC分类号： H01L23/66 ,  H01L23/498 ,  H01L23/367 ,  H01L23/00

摘要： A method and a high-frequency module that includes (a) a high frequency die that includes multiple die pads, (b) a substrate that comprises a first buildup layer, a second buildup layer and a core that is positioned between the first buildup layer and a second buildup layer, (c) a heat sink and coupling module that comprises a heat sink and multiple first conductors that pass through the heat sink and extend outside the heat sink; (d) a line card that comprises multiple line card pads that are coupled to external ends of the multiple first conductors; (e) coupling elements that are coupled to internal end of the multiple first conductors; and (f) multiple second conductors that pass through the substrate without reaching a majority of a depth of the core, and couple the multiple die pads to the coupling elements. The high frequency it not lower than fifty gigabits per second.