公开(公告)号：US20080239228A1

公开(公告)日：2008-10-02

申请号：US11952574

申请日：2007-12-07

Applicant: Gyu-su LEE

Inventor： Gyu-su LEE

IPC: G09G3/36 ,  G02F1/133

CPC classification number: G02F1/13452 ,  G09G3/3611 ,  G09G3/3677 ,  G09G2300/0426 ,  G09G2320/0223

Abstract: A film-chip complex includes a film which includes a connection region along one side, a chip which is mounted on the film, a gate signal line which is disposed on the film, wherein the gate signal line includes a gate lead which is disposed in the connection region and a gate main line which connects the chip with the gate lead and a signal line which is disposed on the film, wherein the signal line includes a signal lead which is disposed in the connection region, a signal main line which extends substantially toward an exterior of the connection region and a signal pad which is connected with the signal main line.

Abstract translation: 薄膜芯片复合体包括膜，其包括沿着一侧的连接区域，安装在膜上的芯片，设置在膜上的栅极信号线，其中栅极信号线包括设置在栅极引线上的栅极引线 所述连接区域和连接所述芯片与所述栅极引线的栅极主线和设置在所述膜上的信号线，其中，所述信号线包括设置在所述连接区域中的信号引线，基本上延伸的信号主线 朝向连接区域的外部和与信号主线连接的信号焊盘。