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公开(公告)号:US20210332074A1
公开(公告)日:2021-10-28
申请号:US16627243
申请日:2018-12-27
发明人: Jung-Woo PARK , Jang-Hyeon SEOK , Hyo-Suk KIM , Ming-Sung PARK
IPC分类号: C07F15/06 , C23C16/18 , C23C16/455
摘要: The present invention relates to a vapor deposition compound enabling thin-film deposition through vapor deposition, and more particularly to a novel cobalt precursor, which can be applied to atomic layer deposition (ALD) or chemical vapor deposition (CVD) and exhibits superior reactivity, volatility and thermal stability, a method of preparing the same and a method of manufacturing a thin film using the same.