公开(公告)号：US12137545B2

公开(公告)日：2024-11-05

申请号：US17932765

申请日：2022-09-16

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： See Yun Yow ,  Kah Hoe Ng ,  Chien-Shuo Tang

IPC: H05K9/00 ,  H01L23/473 ,  H02M7/00 ,  H05K7/20

Abstract: Example implementations relate to an integrated circuit (IC) package, an electronic device having the IC package, and a method of assembling the IC package to a printed circuit board (PCB) of the electronic device. The IC package includes a substrate, a chip, and an electromagnetic shield. The chip is coupled to the substrate. The electromagnetic shield is coupled to the substrate such that the chip is enclosed between the substrate and the electromagnetic shield. The electromagnetic shield includes a ferromagnetic material. Further, the electromagnetic shield protrudes beyond the substrate and is electrically grounded to the PCB to prevent an electromagnetic interference (EMI) noise from radiating through the IC package.

公开(公告)号：US20240098952A1

公开(公告)日：2024-03-21

申请号：US17932765

申请日：2022-09-16

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： See Yun Yow ,  Kah Hoe Ng ,  Chien-Shuo Tang

IPC: H05K9/00 ,  H01L23/473 ,  H02M7/00 ,  H05K7/20

CPC classification number: H05K9/0088 ,  H01L23/473 ,  H02M7/003 ,  H05K7/20281

Abstract: Example implementations relate to an integrated circuit (IC) package, an electronic device having the IC package, and a method of assembling the IC package to a printed circuit board (PCB) of the electronic device. The IC package includes a substrate, a chip, and an electromagnetic shield. The chip is coupled to the substrate. The electromagnetic shield is coupled to the substrate such that the chip is enclosed between the substrate and the electromagnetic shield. The electromagnetic shield includes a ferromagnetic material. Further, the electromagnetic shield protrudes beyond the substrate and is electrically grounded to the PCB to prevent an electromagnetic interference (EMI) noise from radiating through the IC package.